Gold alloy plating bath and process

Details Gold alloy plating bath and process Gold alloy plating bath and process

1985-01-31

1986-10-07

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 362

Patent

active

046157743

ABSTRACT:
A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate salts (for example, nickel citrate) are avoided.

REFERENCES:
patent: 3475290 (1969-10-01), Yamamura et al.
patent: 4069113 (1978-01-01), Crossley et al.

Affiliated with

Also associated with

Rating

Gold alloy plating bath and process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gold alloy plating bath and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gold alloy plating bath and process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-641703