Glue deposit device for power printed circuit board

Details Glue deposit device for power printed circuit board Glue deposit device for power printed circuit board

1998-07-24

2000-04-04

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

B32B 3100

Patent

active

060456531

ABSTRACT:
The glue deposit device and method for automatically mounting a plurality of power devices to a heatsink using a plurality of spring clamps. The fully automated unconventional pick-and-place machine and method utilizing the glue deposit device for assembling the power printed circuit board using the spring clamps are also disclosed.

REFERENCES:
patent: 5615735 (1997-04-01), Yoshida et al.

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