Global planarization process

Details Global planarization process Global planarization process

1991-12-31

1994-02-08

Quach, T. N.

Fishing, trapping, and vermin destroying

437195, 437238, 437240, 437245, 156632, 156653, H01L 21461

Patent

active

052848043

ABSTRACT:
A novel global planarization process is disclosed which is fully compatible with semiconductor processing. The process disclosed is called metal melt-solidification planarization (MMSP). A layer of a low melting point/high boiling point metal such as tin or a suitable alloy is deposited on a nonplanar wafer surface via physical-vapor deposition or chemical-vapor deposition or evaporation or plating. The wafer is then heated to above the tin melting point, cooled back to resolidify tin, and etched back to form a globally planar surface.

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