Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-02-28
2006-02-28
Gurley, Lynne A. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S113000, C438S114000, C438S118000, C438S149000, C438S455000, C438S456000, C438S458000, C438S459000, C438S460000, C438S462000, C438S464000, C438S465000, C438S977000
Reexamination Certificate
active
07005319
ABSTRACT:
In accordance with the present invention, a method for producing at least two different chips with a controlled total chip thickness such that when these chips are placed into a corresponding pocket of a plurality of pockets located in a wafer chip carrier wherein each of the plurality of pockets have a total pocket depth (Tdp) at least substantially equal to one another, a substantially planarized top surface of said wafer chip carrier is achieved. The method comprises forming at least a first chip on a first dummy carrier and at least a second chip different from the first chip on a separate second dummy carrier using partial wafer bonding and partial wafer dicing. The method further includes using a chip thickness control mechanism in conjunction with said partial wafer bonding and partial wafer dicing in forming the at least a first chip and at least second chip different from the first chip, such that the at least first chip and the at least second different chip formed from each carrier each have a final total chip thickness (FTC) which is substantially equal to one another, and an FTC which is substantially equal to a total pocket depth (Tdp) of each of the uniform pockets of said wafer chip carrier, minus the final thickness of an attaching material (FTG) used within said each respective pocket.
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Chen Howard Hao
Hsu Louis L.
Ji Brian L.
Gurley Lynne A.
Harrington & Smith ,LLP
International Business Machines - Corporation
Karra Satheesh K.
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