Glide head assembly and method therefor

Measuring and testing – Surface and cutting edge testing – Roughness

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G01B 528

Patent

active

056890648

ABSTRACT:
A glide head assembly is associated with a support structure for use with a system for testing a moving surface to detect a presence of asperities thereon. This system includes signal processing operative to process an electronic signal generated in response to the presence of an asperity. The glide head assembly comprises a flexure adapted to be secured to the support structure and positionable in proximity to the moving surface. A slider is secured to a distal end portion of the flexure. A piezoelectric transducer is sandwiched partly between the slider and the distal end portion and preferably includes a free end portion which projects outwardly from this region to define a cantilever having a selected length and width. A test device for testing a moving surface on a rotating disk to determine a presence of asperities and a methodology for producing a glide head assembly for use with such a system are also provided.

REFERENCES:
patent: 4532802 (1985-08-01), Yeack-Scranton et al.
patent: 5086360 (1992-02-01), Smith et al.
patent: 5166847 (1992-11-01), Zak
patent: 5423207 (1995-06-01), Flechsig et al.
patent: 5450747 (1995-09-01), Flechsig et al.
patent: 5488857 (1996-02-01), Homma et al.
patent: 5499153 (1996-03-01), Uemura et al.
"Reproduction of Slider Vibrations During Head/Disk Interactions Using PZT Sensors", by IEEE Transactions of Magnetics, vol. 24, No. 6, Nov., 1988.
"Novel Piezoelectric Transducers to Monitor Head-Disk Interactions " by IEEE Transactions of Magnetics, vol. Mag-22, No. 5, Sep., 1986.

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