Glassy binder system for ceramic substrates, thick films and the

Details Glassy binder system for ceramic substrates, thick films and the Glassy binder system for ceramic substrates, thick films and the

1989-11-08

1992-06-30

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 15, 501 32, 501 52, C03C 814, C03C 802

Patent

active

051262924

ABSTRACT:
A ceramic material for electronic circuit devices is sintered at less than r equal to 1000.degree. C. temperature. A filler material such as quartz and a glassy binder RO-Al.sub.2 O.sub.3 -B.sub.2 O.sub.3 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, CaO, SrO, BaO, ZnO or CdO and the glassy binders form no more than 40 vol % of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications.

REFERENCES:
patent: 5043302 (1991-08-01), Mattox

Affiliated with

Also associated with

Rating

Glassy binder system for ceramic substrates, thick films and the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Glassy binder system for ceramic substrates, thick films and the, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Glassy binder system for ceramic substrates, thick films and the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1863589