Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...
Patent
1988-03-25
1991-08-27
Dixon, Jr., William R.
Compositions: ceramic
Ceramic compositions
Glass compositions, compositions containing glass other than...
501 15, 501 32, 501 52, C03C 814, C03C 802
Patent
active
050433024
ABSTRACT:
A ceramic material for electronic circuit devices is sintered at less than or equal to 1000.degree. C. temperature. A filler material such as quartz and a glassy binder RO--Al.sub.2 O.sub.3 --B.sub.2 O.sub.3 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, CaO, SrO, BaO, ZnO or CdO and the glassy binders form no more than 40 vol% of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications.
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Brunsman David M.
Dixon Jr. William R.
Fendelman Harvey
Keough Thomas G.
The United States of America as represented by the Secretary of
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