Measuring and testing – Gas analysis – Moisture content or vapor pressure
Patent
1976-03-11
1977-04-26
Smith, Al Lawrence
Measuring and testing
Gas analysis
Moisture content or vapor pressure
73 885SD, 73420, 228124, 228179, 338 4, G01L 904
Patent
active
040193888
ABSTRACT:
A pressure sensitive Silicon chip is indirectly bonded to a Stainless Steel housing of an electronic pressure transmitter through an intermediate holder assembly. This indirect bonding prevents thermal cracking of the Silicon chip due to the difference in thermal expansion of the Stainless Steel housing and the Silicon chip. The holder assembly includes a Borosilicate glass tube having the Silicon chip bonded thereto which tube is soldered to a Nickel-Iron alloy holder by a eutectic alloy solder. In assembly, the Nickel-Iron holder is first brazed to the stainless Steel housing at a first temperature greater than the maximum non-destructive temperature of either the chip or the glass tube and the glass tube is then soldered to the Nickel-Iron holder at a lower temperature which will not destroy the chip or the tube holder.
REFERENCES:
patent: 3305818 (1967-02-01), Brueggemann
patent: 3697917 (1972-10-01), Orth et al.
Hall, II George R.
Krechmery Roger L.
White Jack M.
Bailey Meter Company
Maguire Joseph M.
Matas Vytas R.
Ramsey K. J.
Smith Al Lawrence
LandOfFree
Glass to metal seal does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Glass to metal seal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Glass to metal seal will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2082103