Glass substrate for a semiconductor device and method for making

Details Glass substrate for a semiconductor device and method for making Glass substrate for a semiconductor device and method for making

1992-03-18

1994-03-15

Jones, W. Gary

Glass manufacturing

Processes

With coating

65 605, 65 608, 65 95, 501 7, C03C 1734, C03B 2500

Patent

active

052942384

ABSTRACT:
A glass substrate usable for a semiconductor device which shrinks less during a heating process. Specifically, lithium is added to the glass substrate material prior to formation. Further, the glass substrate can be thermal annealed in advance. In accordance with the present invention, it is possible to reduce substrate shrinkage even during TFT processing, by using glass material including more than 4% by weight of lithium, and further by heating the glass substrate at a temperature below the glass strain point temperature.

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patent: 3856497 (1974-12-01), Hummel
patent: 4238276 (1980-12-01), Kinugawa et al.
patent: 4413061 (1983-11-01), Kumar et al.
patent: 4769058 (1988-09-01), McMaster
patent: 4851363 (1989-07-01), Troxell et al.
patent: 4992393 (1991-02-01), Kosaka et al.

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