Glass-sealed semiconductor device

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Details

357 70, 357 74, H01L 2329

Patent

active

050879634

ABSTRACT:
In a glass-sealed semiconductor device, low-melting glass is glazed on a ceramic base to fix a lead frame. A distal end portion of the lead frame, the distal end portion being connected to a semiconductor element, is fixed to the ceramic base through devitrifying glass layer.

REFERENCES:
patent: 3697666 (1972-10-01), Wakley et al.
patent: 4590672 (1986-05-01), Shimizu et al.

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