Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly
Reexamination Certificate
2004-04-13
2008-08-05
Williams, Joseph L (Department: 2889)
Electric lamp or space discharge component or device manufacturi
Process
With assembly or disassembly
C445S023000
Reexamination Certificate
active
07407423
ABSTRACT:
A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.
REFERENCES:
patent: 3414465 (1968-12-01), Trygve, et al.
patent: 3520831 (1970-07-01), Trap
patent: 3614825 (1971-10-01), Rottmiller
patent: 3885974 (1975-05-01), Asahara et al.
patent: 3973975 (1976-08-01), Francel et al.
patent: 3995941 (1976-12-01), Nagahara et al.
patent: 4206382 (1980-06-01), DeBois
patent: 4269617 (1981-05-01), Shibuya et al.
patent: 4328022 (1982-05-01), Bonk et al.
patent: 4330596 (1982-05-01), Van Assche
patent: 5192240 (1993-03-01), Komatsu
patent: 5281560 (1994-01-01), Francis et al.
patent: 5641611 (1997-06-01), Shieh et al.
patent: 5693956 (1997-12-01), Shi et al.
patent: 5734225 (1998-03-01), Biebuyck et al.
patent: 5771562 (1998-06-01), Harvey, III et al.
patent: 5821692 (1998-10-01), Rogers et al.
patent: 5855994 (1999-01-01), Biebuyck et al.
patent: 5872355 (1999-02-01), Hueschen
patent: 5874804 (1999-02-01), Rogers
patent: 5895228 (1999-04-01), Biebuyck et al.
patent: 5920080 (1999-07-01), Jones
patent: 5929474 (1999-07-01), Huang
patent: 5952778 (1999-09-01), Haskal et al.
patent: 5985069 (1999-11-01), Kawabe et al.
patent: 5998805 (1999-12-01), Shi et al.
patent: 6069443 (2000-05-01), Jones et al.
patent: 6096496 (2000-08-01), Frankel
patent: 6137221 (2000-10-01), Roitman et al.
patent: 6146225 (2000-11-01), Sheats et al.
patent: 6226890 (2001-05-01), Boroson et al.
patent: 6245699 (2001-06-01), Hudecek et al.
patent: 6268695 (2001-07-01), Affinito
patent: 6337381 (2002-01-01), Biebuyck et al.
patent: 6356376 (2002-03-01), Tonar et al.
patent: 6370019 (2002-04-01), Matthies et al.
patent: 6436222 (2002-08-01), Andre et al.
patent: 6436739 (2002-08-01), Wickboldt et al.
patent: 6465953 (2002-10-01), Duggal
patent: 6470594 (2002-10-01), Boroson et al.
patent: 6552488 (2003-04-01), Roitman et al.
patent: 6566805 (2003-05-01), Tsai et al.
patent: 6586496 (2003-07-01), Takamatsu et al.
patent: 6608283 (2003-08-01), Liu et al.
patent: 6661029 (2003-12-01), Duggal
patent: 6733850 (2004-05-01), Domi et al.
patent: 6734615 (2004-05-01), Sugawara et al.
patent: 6911667 (2005-06-01), Pichler et al.
patent: 6976372 (2005-12-01), Cooper et al.
patent: 2001/0015620 (2001-08-01), Affinito
patent: 2001/0033135 (2001-10-01), Duggal et al.
patent: 2001/0045565 (2001-11-01), Yamazaki
patent: 2001/0048234 (2001-12-01), Liu et al.
patent: 2001/0049197 (2001-12-01), Yamazaki et al.
patent: 2001/0053082 (2001-12-01), Chipalkatti et al.
patent: 2001/0055841 (2001-12-01), Yamazaki et al.
patent: 2002/0003571 (2002-01-01), Shofield et al.
patent: 2002/0004577 (2002-01-01), Biebuyck et al.
patent: 2002/0008463 (2002-01-01), Roch
patent: 2002/0015032 (2002-02-01), Koyama et al.
patent: 2002/0031874 (2002-03-01), Yamazaki et al.
patent: 2002/0050958 (2002-05-01), Matthies et al.
patent: 2002/0080463 (2002-06-01), Tonar et al.
patent: 2002/0097368 (2002-07-01), Kijima et al.
patent: 2002/0109136 (2002-08-01), Seo et al.
patent: 2002/0113241 (2002-08-01), Kubota et al.
patent: 2002/0113763 (2002-08-01), Koyama
patent: 2002/0125484 (2002-09-01), Silvernail et al.
patent: 2002/0125822 (2002-09-01), Graff et al.
patent: 2002/0132047 (2002-09-01), Yamazaki et al.
patent: 2002/0133086 (2002-09-01), Connelly et al.
patent: 2002/0143258 (2002-10-01), Weiner et al.
patent: 2002/0149312 (2002-10-01), Roberts et al.
patent: 2002/0152800 (2002-10-01), Bouten et al.
patent: 2002/0154379 (2002-10-01), Tonar et al.
patent: 2002/0182828 (2002-12-01), Asami et al.
patent: 2002/0187254 (2002-12-01), Ghosh et al.
patent: 2002/0187594 (2002-12-01), Yamazaki et al.
patent: 2002/0190661 (2002-12-01), Duggal et al.
patent: 2003/0017297 (2003-01-01), Song et al.
patent: 2003/0066311 (2003-04-01), Li et al.
patent: 2003/0184219 (2003-10-01), Duggal et al.
patent: 2003/0222061 (2003-12-01), Langer et al.
patent: 2003/0227024 (2003-12-01), Yoshii et al.
patent: 2004/0069017 (2004-04-01), Li et al.
patent: 2005/0217320 (2005-10-01), Eberhardt et al.
patent: 2006/0003883 (2006-01-01), Yoshida et al.
patent: 2007/0184963 (2007-08-01), Yoshida et al.
patent: 2007/0191203 (2007-08-01), Yoshida et al.
patent: 1595856 (2005-11-01), None
patent: 1298397 (1970-04-01), None
patent: 01225140 (1989-08-01), None
patent: 2-267137 (1990-10-01), None
patent: 2000-086286 (2000-03-01), None
patent: 2000-251722 (2000-09-01), None
patent: 2001-319775 (2001-11-01), None
patent: 2001-351521 (2001-12-01), None
patent: 2002-137939 (2002-05-01), None
patent: 2003-187962 (2003-07-01), None
patent: 2003-192378 (2003-07-01), None
patent: 2004-250276 (2004-09-01), None
patent: 2005-063835 (2005-03-01), None
patent: WO93/12049 (1993-06-01), None
patent: WO 00/57499 (2000-09-01), None
patent: WO 00/69002 (2000-11-01), None
patent: WO 01/05205 (2001-01-01), None
patent: WO 01/44865 (2001-06-01), None
patent: WO 02/05361 (2002-01-01), None
patent: WO 02/21557 (2002-03-01), None
patent: WO 02/21557 (2002-03-01), None
patent: WO03/005774 (2003-12-01), None
patent: WO 03/100832 (2003-12-01), None
H. Hirashima et al., “Electrical Conductivity of Fe2O3-V2O5-P2O5Glasses”, Journal of the American Ceramic Society, vol. 66, No. 10, Oct. 1983, pp. 704-708.
H. Hirashina et al., “Effect of Basic Additive Oxides on Electrical Conductivity of Vanadate Glasses”, Journal of Non-Crystalline Solids, vol. 95 & 96, 1987, pp. 817-824, no month.
“Standard Practice for Making Reference Glass-Metal Sandwich Seal and Testing for Expansion Characteristics by Polarimetric Methods”, The American Society of Testing Materials—Designation: F144-80 (Reapproved 2000), pp. 502-506, no month.
Milos B. Volf, “Chemical Approach to Glass”, Glass Science and Technology, vol. 7, 1984, p. 349, 394, 330, no month.
“Corning® EAGLE2000™ AMLCD Glass Substrates”, MTE 201, Aug. 2002, pp. 1-3.
“Corning® 1737 AMLCD Glass Substrates”, MIE 101, Aug. 2002, pp. 1-3.
“Laser-fabricated glass microlens arrays”, Optics Letters, vol. 23, No. 2, Jan. 15, 1998, pp. 141-143.
“OLED Encapsulation”, Information Display Jul. 2002, p. 26-28.
Aitken Bruce G.
Carberry Joel P.
DeMartino Steven E.
Hagy Henry E.
Lamberson Lisa A.
Able Kevin M.
Beall Thomas R.
Corning Incorporated
Williams Joseph L
LandOfFree
Glass package that is hermetically sealed with a frit and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Glass package that is hermetically sealed with a frit and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Glass package that is hermetically sealed with a frit and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4010455