Glass-moulded type semiconductor device

Details Glass-moulded type semiconductor device Glass-moulded type semiconductor device

1976-04-05

1977-11-22

James, Andrew J.

357 65, 357 67, 357 68, 357 71, 357 74, H01L 2330, H01L 2348, H01L 2940

Patent

active

040598373

ABSTRACT:
A semiconductor device according to the present invention comprises a silicon pellet adhesively fixed with a soft solder between a pair of leads provided with headers and having a thermal expansion coefficient greatly different from those of the silicon pellet and mould glass. An assembly including the silicon pellet is then glass-moulded to provide semiconductor device. The leads are provided with a film having low wetness to glass for preventing a breakage of the mould glass due to the difference between the thermal expansion coefficients.

REFERENCES:
patent: 3032695 (1962-05-01), Zielasek
patent: 3237272 (1966-03-01), Kallander
patent: 3365628 (1968-01-01), Luxem et al.
patent: 3913127 (1975-10-01), Suzuki et al.
patent: 3930306 (1976-01-01), Goldberg et al.

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