Glass inlays for use in bonding semiconductor wafers

Details Glass inlays for use in bonding semiconductor wafers Glass inlays for use in bonding semiconductor wafers

1985-04-30

1986-09-02

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

1562722, 338 2, 361283, H01G 700, H01L 21306, G01L 912

Patent

active

046099689

ABSTRACT:
A structure is provided, such as a capacitive transducer, utilizing two or more layers of semiconductor material wherein a highly insulating low capacitance bond is achieved by the invention herein between two adjacent layers by forming an inlay of glass in one layer and anodically bonding the other layer to the polished surface of the previously formed inlay.

REFERENCES:
patent: 3210171 (1965-10-01), MacDonald
patent: 3713068 (1973-01-01), Talmo
patent: 4079508 (1978-03-01), Nunn
patent: 4188258 (1980-02-01), Mounteer et al.
patent: 4424713 (1984-01-01), Kroninger et al.
patent: 4495820 (1985-01-01), Shimada et al.
patent: 4506435 (1985-03-01), Pliskin et al.
patent: 4530029 (1985-07-01), Beristain

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