Glass hermetic seal

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

65 5931, 65 5935, 174 5061, H01L 2308

Patent

active

043496920

ABSTRACT:
An improved sealing glass composition for making compression glass electrical feedthroughs in semiconductor device packages is described wherein the improved sealing glass consists essentially of (by weight percent) 63-68% SiO.sub.2, 3-6% Al.sub.2 O.sub.3, 8-9% K.sub.2 O, 5-6% Na.sub.2 O, 0.5-1.5% Li.sub.2 O, 2-4% BaO, 5-7% SrO, 2-4% CaO, 0.5-1.5% MgO, 0.5-1.5% TiO.sub.2, and 0.5-1.5% B.sub.2 O.sub.3.

REFERENCES:
patent: 3176201 (1965-03-01), Dickson, Jr. et al.
patent: 3356466 (1967-12-01), Wildeboer et al.
patent: 4128697 (1978-12-01), Simpson

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