Glass for encapsulation of diodes

Details Glass for encapsulation of diodes Glass for encapsulation of diodes

1977-03-30

1978-02-28

Douglas, Winston A.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C03C 310

Patent

active

040765431

ABSTRACT:
This invention is concerned with the production of glasses especially suitable for the encapsulation of semiconductor devices and, in particular, for the encapsulation of germanium and silicon diodes. The glasses have a low softening point, i.e., less than about 550.degree. C., are readily sealable to Dumet, and exhibit a viscosity at the liquidus of at least 20,000 poises. The glasses have compositions within the K.sub.2 O-PbO-B.sub.2 O.sub.3 -SiO.sub.2 system, are essentially free from Li.sub.2 O, Na.sub.2 O, Al.sub.2 O.sub.3, and TiO.sub.2, and demonstrate a mismatch in thermal expansion with Dumet at about 400.degree. C. of no more than about 200 PPM.

REFERENCES:
patent: 2736714 (1956-02-01), Tiede
patent: 2830000 (1958-04-01), Labino
patent: 2946704 (1960-07-01), King et al.
patent: 3238151 (1966-01-01), Kim
patent: 3854964 (1974-12-01), Thomas et al.
patent: 3973976 (1976-08-01), Boyd
patent: 4018613 (1977-04-01), Martin

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