Glass-encapsulated semiconductor device containing cylindrical s

Details Glass-encapsulated semiconductor device containing cylindrical s Glass-encapsulated semiconductor device containing cylindrical s

1977-06-22

1979-04-03

Clawson, Jr., Joseph E.

357 75, 357 76, H01L 2330

Patent

active

041480562

ABSTRACT:
A glass-encapsulated semiconductor device characterized in that a rectifier unit comprises a lamination of electrically series-connected and mechanically bonded semiconductor pellets and an electric-conductive spacer, and a pair of electrodes with external lead wires which are electrically connected and mechanically bonded with said lamination by means of soldering materials, the peripheral surface of the rectifier unit is covered with a protective glass layer over the entire length from one of the electrodes to the other, said conductive spacer having such a thickness that the thermal expansion coefficient of said spacer may be equal to the average thermal expansion coefficient of a virtual laminated column of said semiconductor pellets alone.

REFERENCES:
patent: 3913127 (1975-10-01), Suzuki et al.
patent: 3945111 (1976-03-01), Greeson et al.
Handbook of Chemistry and Physics, 44th Edition, .COPYRGT.1961, Chem. Rubber Publ. Co., Cleveland, Ohio, p. 2330.

Affiliated with

Also associated with

Rating

Glass-encapsulated semiconductor device containing cylindrical s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Glass-encapsulated semiconductor device containing cylindrical s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Glass-encapsulated semiconductor device containing cylindrical s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1749467