Glass containing resistor having a sub-micron metal film termina

Details Glass containing resistor having a sub-micron metal film termina Glass containing resistor having a sub-micron metal film termina

1974-11-29

1977-04-05

Goldberg, E. A.

Electrical resistors

With base extending along resistance element

Resistance element coated on base

338308, 338328, H01C 1012

Patent

active

040165256

ABSTRACT:
A cermet resistor employs film terminations of sub-micron thickness. The terminations contain particles of SiO.sub.2 or MnO.sub.2 that may be conveniently made by mixing such particles in a metal resinate paste, screening the paste on a glazed or unglazed substrate and firing. A glass containing resistor paste is screened in overlapping relationship with the fired terminations and is itself fired. The particle additives ameliorate cracking of the terminations at resistor firing and enhance the termination to substrate bond.

REFERENCES:
patent: 3370262 (1968-02-01), Marty
patent: 3434877 (1969-03-01), Degenkolb
Shih "Improved Silver-Palladium Termination Metallization for Thick Film Resistors" in Int. Micro. Symp., Boston, Mass, 10/23/74, pp. 35-37 (copy in file).
Kuo "Electrical Applications of Thin Films Produced by Metallo Organic Deposition" in Int. Micro. Symp., San Francisco, Cal., 10/22/73, pp.4A-21-4A-7-8.
Miller, "Thick Film Technology & Chip Joining" Gordon & Breach, N.Y., 1972, pp. 73 & 74.

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