Glass composition for passivating semiconductor surfaces

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

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106 53, 106 54, 357 73, 427 93, 428325, 428426, 428428, C03C 304

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041336909

ABSTRACT:
Glass compositions useful for passivating silicon semiconductor elements or bodies and to semiconductor elements or bodies coated by such glass compositions. The glass compositions are applied onto the surface of the semiconductor in the form of a finely ground powder and thereafter fused on at least a portion of the semiconductor element. The compositions comprise: (A) glass and (B) powdered cordierite in an amount effective to provide a coefficient of thermal expansion of up to 40 .times. 10.sup.-7 /.degree. C for said composition within the temperature range of 20.degree.-300.degree. C. The compositions are compatible with the thermal expansion of the silicon semiconductor and capable of adhering to the silicon in layers greater than 10 .mu.m without the formation of cracks.

REFERENCES:
patent: 3290565 (1966-12-01), Hastings
patent: 3533832 (1970-10-01), De Volder
patent: 3679464 (1972-07-01), Eppler
patent: 3922471 (1975-11-01), Ellis
patent: 3961114 (1976-06-01), Berkenblit et al.
Chem. Technology : An Encyclopedia Treatment by Dr. J. F. van Oss, vol. II.

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