Glass cloth for printed circuits and method of manufacture where

Details Glass cloth for printed circuits and method of manufacture where Glass cloth for printed circuits and method of manufacture where

1983-12-19

1986-04-01

Cannon, James C.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including interlaminar mechanical fastener

139420C, 428273, 428397, 428901, B32B 1702, B32B 1704

Patent

active

045797722

ABSTRACT:
Woven glass cloth and method of its manufacture suitable for use as a resin-impregnated substrate for printed circuits in which the major dimension or transverse axis of the elliptical warp yarns exceeds a predetermined fraction of that dimension of the fill yarns of the woven cloth. Multi-filament warp yarns are typically subjected to tensile stress during weaving and firing such that the yarn compaction prevents the thorough impregnation by a resin. The result is that voids are maintained along the innermost filaments of the yarn. These voids, when filled with materials other than resin, such as plating solution, ultimately produce circuit failures.

REFERENCES:
patent: 3085027 (1963-04-01), Porteous
patent: 3461025 (1969-08-01), Coleman et al.
patent: 3579409 (1971-05-01), Shannon
patent: 4428995 (1984-01-01), Yokono et al.
patent: 4461855 (1984-07-01), Phillips
patent: 4513055 (1985-04-01), Leibowitz
OTS Bulletin, OTS 63-189, 3/18/63, U.S. Dept. of Commerce.

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