Glass cloth and printed wiring board

Details Glass cloth and printed wiring board Glass cloth and printed wiring board

2006-05-23

2006-05-23

Befumo, Jenna-Leigh (Department: 1771)

Fabric (woven, knitted, or nonwoven textile or cloth, etc.)

Woven fabric

Including strand which is of specific structural definition

C442S189000, C442S192000, C428S901000, C139S42000D

Reexamination Certificate

active

07049253

ABSTRACT:
The present invention is(1) a glass cloth composed of a group of warp yarns and a group of weft yarns wherein one of the group of the warp and weft yarns are arranged with substantially no gap between the yarns, and, in that group, a width A (μm) of a cross-section of the yarn arranged with substantially no gap, a single-fiber diameter L (μm) of the yarn, the number N of single-fibers constituting the yarn and a weaving density C (ends/25 mm) of the glass cloth composed of the yarns satisfy the following equation (1-a):in-line-formulae description="In-line Formulae" end="lead"?C×A/(25×L×N)≧1.0, and   (1-a)in-line-formulae description="In-line Formulae" end="tail"?(2) a glass cloth composed of a group of warp yarns and a group of weft yarns wherein both of the groups of the warp and weft yarns are arranged with substantially no gap between the yarns, and, in both the groups, a width A (μm) of a cross-section of the yarn, a single-fiber diameter L (μm) of the yarn, the number N of single-fibers constituting the yarn and a weaving density C (ends/25 mm) of the glass cloth satisfy the following equation (1-b):in-line-formulae description="In-line Formulae" end="lead"?C×A/(25×L×N)≧0.75.   (1-b)in-line-formulae description="In-line Formulae" end="tail"?The glass cloth according to the present invention is useful as a substrate for a printed wiring board. The printed wiring board using the glass cloth of the present invention as a substrate is capable of being bored with a laser beam to produce micro-holes (the roughness of the inner wall, the reproducibility and the roundness of the micro-holes are improved) therein, especially, is able to prepare uniform and small via-holes which are recently required for high-density wiring.

REFERENCES:
patent: 5217796 (1993-06-01), Kasai et al.
patent: 5662990 (1997-09-01), Scari et al.
patent: 05-286065 (1993-11-01), None
patent: 09-111577 (1997-04-01), None
patent: 10-37038 (1998-02-01), None
patent: 10-272733 (1998-10-01), None
patent: 11-61596 (1999-03-01), None
patent: 11-315446 (1999-11-01), None
JP 11-61596 English Translation Mar. 1999.

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