Glass circuit substrate and fabrication method thereof

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428209, 428434, 428469, 428620, 428630, 428670, 428671, 428672, 428673, 106 111, 106 124, 106 128, B32B 300

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active

061564133

ABSTRACT:
A glass circuit substrate wherein nuclei of Pd (palladium) are placed on a glass substrate and a plating layer of Pd--P (palladium--phosphorus) is placed on the nuclei. A fabrication method of the glass circuit substrate comprises steps of forming nuclei of Pd on a glass substrate; and therefore forming a plating layer of Pd--P on the nuclei.

REFERENCES:
patent: 3754939 (1973-08-01), Pearlstein et al.
patent: 4255194 (1981-03-01), Hough et al.
patent: 4424241 (1984-01-01), Abys
patent: 5569545 (1996-10-01), Yokono et al.
patent: 5810913 (1998-09-01), Kanoh et al.
patent: 5882736 (1999-03-01), Stein et al.
Hotta et al., "Adhesion of Electroless Nickel Plating on Glass", Hyomen Gijutsu (Surface Technology), vol. 44, No. 10, 1993, pp. 67-71.
Mizumoto, et al., "Electroless Plating of Pd-P Alloys from Ethylenediamine Complex Solutions", Hyomen Gijutsu, vol. 40, No. 3, 1989, pp. 123-126.
Honma, et al., "Electroless Pd-P Alloy Plating and Properties of the Deposited Film", Journal of Japan Institute of Printed Circuit "Circuit Technology", 7(4), pp. 263-271 (1992).
Otsuka, et al., "The Low Stress Electroless Palladium Plating and the Property of the Deposits", Journal of Japan Institute of Printed Circuit "Circuit Technology", 7(6), pp. 369-376 (1992).
Mizumoto, et al., "Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating from a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent", Hyomen Gijutsu, vol. 44, No. 5, 1993, pp. 33-37.
Chinda, et al., "Characteristics of Palladium Plated Lead Frames after Thermal Treatment", Hyomen Gijutsu, vol. 44, No. 12, 1993, pp. 136-139.
Haga, et al., "Electroless Pd-P Alloy Plating Using Phosphite as a Reducing Agent and Mechanism of its Autocatalytic Reduction", Hyomen Gijutsu, vol. 42, No. 11, 1992, pp. 90-95.
Patent Abstracts of Japan, 97, 2 (Feb. 1997) for JP 08-271869.
Patent Abstracts of Japan, 18, (E-1558) Jun. 1994 for JP 06-61619.

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