Glass-ceramics for electronic packaging

Details Glass-ceramics for electronic packaging Glass-ceramics for electronic packaging

1988-08-31

1990-01-30

Bell, Mark L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

428137, 428209, 428210, 428426, 428432, 428901, 501 9, 501 61, 501 62, 501 67, 501 69, 361414, H05K 103

Patent

active

048975095

ABSTRACT:
This invention relates to the production of glass-ceramic materials particularly suitable for use as substrates in integrated circuit packaging. The inventive glass-ceramics can be prepared from thermally crystallizable glass capable of being concurrently sintered and crystallized in situ at temperatures between about 850.degree.-1000.degree. C. to bodies exhibiting dielectric constants less than about 6, linear coefficients of thermal expansion between about 12-60.times.10.sup.-7 /.degree.C. and containing cordierite solid solution as essentially the sole crystal phase. The glass-ceramics are essentially free from Li.sub.2 O and Na.sub.2 O and consist essentially, expressed in terms of weight percent on the oxide basis of 10-25% MgO+ZnO consisting of 2-18% MgO+0-21% ZnO, 20-38% Al.sub.2 O.sub.3, 40-52% SiO.sub.2, and 2-15% total of at least one oxide in the indicated proportion selected from the group consisting of up to 8% of an alkali metal oxide selected from the group consisting of K.sub.2 O, Rb.sub.2 O, and Cs.sub.2 O, up to 10% of a divalent metal oxide selected from the group consisting of CaO, SrO, BaO, and PbO, and up to 5% B.sub. 2 O.sub.3.

REFERENCES:
patent: 3275493 (1966-09-01), MacDowell
patent: 3450546 (1969-06-01), Stong
patent: 3926648 (1975-12-01), Miller
patent: 3967971 (1976-07-01), Eppler
patent: 4413061 (1983-11-01), Kumar et al.
patent: 4540671 (1985-09-01), Kondo et al.
patent: 4588699 (1986-05-01), Brennan et al.

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