Glass-ceramic substrates for electronic packaging

Details Glass-ceramic substrates for electronic packaging Glass-ceramic substrates for electronic packaging

1987-11-27

1989-05-23

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Devitrified glass-ceramics

501 63, 501 65, 501 66, C03C 1002

Patent

active

048331040

ABSTRACT:
This invention is directed to the preparation of glass-ceramic materials especially suitable for use in multilayer substrates for integrated circuit packages. The inventive glass-ceramics are derived from thermally crystallizable glass which, in the form of frit, are capable of being sintered into an integral body at temperatures below 1000.degree. C. and essentially concurrently crystallized in situ to yield BPO.sub.4 as the predominant crystal phase. The inventive glass-ceramics exhibit a linear coefficient of thermal expansion between about 30-45.times.10.sup.-7 /.degree.C., a dielectric constant less than 5, and consist essentially, in weight percent, of 10-25% B.sub.2 O.sub.3, 20-40% P.sub.2 O.sub.5, and >50-65% SiO.sub.2.

REFERENCES:
patent: 3519445 (1970-07-01), MacDowell et al.
patent: 3922155 (1975-11-01), Broemer et al.
patent: 4576920 (1986-03-01), MacDowell

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