Glass bubbles for use as fillers in printed circuit board

Details Glass bubbles for use as fillers in printed circuit board Glass bubbles for use as fillers in printed circuit board

1994-10-03

1997-01-07

Group, Karl

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 66, 501 67, 428405, 428406, C03C 1200

Patent

active

055916848

ABSTRACT:
Glass bubbles for use as fillers in a plastic resin substrate of an electrical printed circuit board are light in weight, low in density, and small in alkali amount leached sufficiently to insure electrical insulation resistance of the substrate, and consist essentially of, by weight, SiO.sub.2 40.0-60.0%, Al.sub.2 O.sub.3 5.0-22.0%, B.sub.2 O.sub.3 1.0-15.0%, CaO 10.0-30.0%, BaO 0-15.0%, MgO 0-10.0%, ZnO 0-10.0%, SrO 0-10.0%, Na.sub.2 O+K.sub.2 O+Li.sub.2 O 0-1.9%, As.sub.2 O.sub.3 +Sb.sub.2 O.sub.3 0-1.54, V.sub.2 O.sub.5 0-10.0%, TiO.sub.2 0-10.0%, and SO.sub.3 0.05-1.7%.

REFERENCES:
patent: 4367919 (1983-01-01), Tung et al.
patent: 4391646 (1983-07-01), Howell
patent: 4983550 (1991-01-01), Goetz et al.
patent: 5100842 (1992-03-01), Stevenson et al.
patent: 5217928 (1993-06-01), Goetz et al.
patent: 5292690 (1994-03-01), Kawachi et al.

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