Glass-based semiconductor on insulator structures and...

Details Glass-based semiconductor on insulator structures and... Glass-based semiconductor on insulator structures and...

2005-06-23

2008-08-12

Smith, Bradley K (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000, C257SE21122

Reexamination Certificate

active

07410883

ABSTRACT:
Methods and apparatus provide for: a semiconductor wafer; at least one porous layer in the semiconductor wafer; an epitaxial semiconductor layer directly or indirectly on the porous layer; and a glass substrate bonded to the epitaxial semiconductor layer via electrolysis.

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