Glass and hermetic seal

Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...

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65 29, 501 66, 501 70, 174 5061, 174 52H, 403 30, 428433, C03C 304, C03C 308

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043095070

ABSTRACT:
An improved sealing glass composition for making compression glass electrical feedthroughs in semiconductor device packages is described wherein the improved sealing glass consists essentially of (by weight percent) 63-68% SiO.sub.2, 3-6% Al.sub.2 O.sub.3, 8-9% K.sub.2 O, 5-6% Na.sub.2 O, 0.5-1.5% Li.sub.2 O, 2-4% BaO, 5-7% SrO, 2-4% CaO, 0.5-1.5% MgO, 0.5-1.5% TiO.sub.2, and 0.5-1.5% B.sub.2 O.sub.3.

REFERENCES:
patent: 3697823 (1972-10-01), Correll
patent: 3805107 (1974-04-01), Boyd
patent: 4065636 (1977-12-01), Herczog
patent: 4128697 (1978-12-01), Simpson
patent: 4255198 (1981-03-01), Danielson et al.

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