Gilding apparatus for semiconductor substrate

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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Details

204225, 204284, 204297M, 204275, C25D 1700, C25D 1706

Patent

active

052289664

ABSTRACT:
According to this invention, a cathode electrode is brought into reliable contact with a semiconductor substrate. A cup-like tank is arranged independently of an outer tank, and adjusting mechanisms are arranged on the cup-like tank for supporting the semiconductor and a head for supporting a cathode electrode, respectively. The adjusting mechanisms keep the semiconductor substrate and the cathode electrode to be horizontal, and the semiconductor substrate and the cathode electrode are brought into reliable contact with each other.

REFERENCES:
patent: 3536594 (1970-10-01), Pritchard
patent: 3763027 (1973-10-01), Pearson
patent: 4240880 (1980-12-01), Tsuchibuchi et al.
patent: 4339319 (1982-07-01), Aigo
patent: 4971676 (1990-11-01), Doue et al.
patent: 5078852 (1992-01-01), Yee et al.

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