Gettering process with multi-step annealing and inert ion implan

Fishing – trapping – and vermin destroying

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148DIG3, 148DIG24, 148DIG60, 148DIG76, 148DIG83, 148DIG97, 148DIG127, 148 332, 156692, 357 91, 437 24, 437 25, 437 82, 437 85, 437247, 437939, H01L 21322, H01L 21265

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048852570

ABSTRACT:
A semiconductor substrate and process for making are disclosed. The substrate is suitable for use in manufacturing large scale integrated circuits. The process comprises the steps of heating a semiconductor substrate at a temperature not lower than 1100.degree. C., implanting electrically inert impurities into the major surface of the substrate, heating the substrate at a temperature ranging from 600.degree. to 900.degree. C. and providing a single crystal semiconductor layer.

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Craven et al., "Internal Gettering of Silicon" Solid State Technology, Jul. 1981, pp. 55-61.
Hu, "Precipitation of Oxygen in Silicon: Some Phenomena and a Nucleation Model," J. Appl. Phys., vol. 52, No. 6, Jun. 1981, pp. 3974-3984.

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