Gettering method for semiconductor wafers

Details Gettering method for semiconductor wafers Gettering method for semiconductor wafers

1988-11-25

1990-11-20

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437 9, 437946, 134 1, H01L 21304, H01L 21463

Patent

active

049719203

ABSTRACT:
An ultrasonic wave is propagated to the surface of a semiconductor wafer in pure water to effect the gettering treatment with respect to the surface of the semiconductor wafer. Mechanical damages are formed on the surface of the semiconductor wafer to which the ultrasonic wave is applied, and at the same time the surface of the semiconductor wafer is cleaned. The mechanical damages serve to function as back side damage.

REFERENCES:
patent: 4092176 (1978-05-01), Kozai et al.
Wolf et al., Silicon Processing for the VLSI Era, vol. 1: Process Technology Lattice Press, Sunset Beach, CA (1986), p. 519.

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