GeSOI transistor with low junction current and low junction...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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Details

C257S019000, C257S347000, C257S374000, C257S410000, C257S092000, C257S344000

Reexamination Certificate

active

11110234

ABSTRACT:
A semiconductor device (101) is provided herein which comprises a substrate (103) comprising germanium. The substrate has source (107) and drain (109) regions defined therein. A barrier layer (111) comprising a first material that has a higher bandgap (Eg) than germanium is disposed at the boundary of at least one of said source and drain regions. At least one of the source and drain regions comprises germanium.

REFERENCES:
patent: 6621131 (2003-09-01), Murthy et al.
patent: 2005/0093084 (2005-05-01), Wang et al.
patent: 2005/0224897 (2005-10-01), Chen et al.
patent: 2005/0282353 (2005-12-01), Wise et al.
patent: 2006/0205167 (2006-09-01), Kavalieros et al.
Dalal and Herrold, “Microcrystalline Germanium Carbide: a New, Almost Direct GAP, Thin Film Material For Photovoltaic Energy Conversion”; Mat. Res. Soc. Symp. Proc., vol. 664; 2001, pp. A25.12.1 through A25.12.5.
H. Shang; “Electrical Characterization of Germanium p-Channel MOSFETs”; IEEE Electron Device Letters; vol. 24, No. 4, Apr. 2003; pp. 242-244.
Huiling Shang; “Self-Aligned n-Channel Germanium MOSFETs With a Thin Ge Oxynitride Gate Dielectric and Tungsten Gate”; IEEE Electron Device Letters; vol. 25, No. 3, Mar. 2004; pp. 135-137.
Dalal and Herrold; “Microcrystalling Germanium Carbide-A New Material for PV Conversion”; Iowa St. University, Dept of Elec and Comp Engr; pp. 348-349.
Meuris, M. et al.; “Germanium Deep-Sub Micron PMOS Transistors With Etched Tan Metal Gate on a High-K Dielectric, Fabricated in a 200MM Prototyping Line”; IMEC, Kapeldreef 75, B-3001 Leuven, Belgium; Lam Research Corp., Fremont, CA 94538, USA, Umicore, B-2250 Olen, Belgium; and KU Leuven, Kasteelpark Arenberg 10, B-3001 Leuven, Belgium; Electrochemical Society Proceedings; vol. 2004-07; pp. 693-700.

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