Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Patent
1997-03-04
1999-07-20
Bowers, Charles
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
438435, 438691, 438692, 438791, H01L 2176
Patent
active
059267232
ABSTRACT:
A method of forming an improved planarization mask for shallow trench isolation process area in integrated circuit manufacturing is disclosed. The planarization mask is generated automatically by using actual mask data as a reference. The invention discloses an algorithm which measures the geometric and relative separation distances of the active areas and performs the necessary merging, deletion and differential biasing to produce the planarization mask which has relaxed geometric boundaries, thereby allowing low cost and simplified manufacturing.
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patent: 5789286 (1998-08-01), Subbanna
patent: 5804492 (1998-09-01), Shen
patent: 5811345 (1998-09-01), Yu et al.
Advanced Micro Devices , Inc.
Bowers Charles
Sulsky Martin
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