General purpose assembly programmable multi-chip package substra

Details General purpose assembly programmable multi-chip package substra General purpose assembly programmable multi-chip package substra

1996-02-02

1998-09-29

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular signal path connections

257700, 257211, 257208, H05K 102, H01L 2702

Patent

active

058148477

ABSTRACT:
A multi-chip module interconnection substrate includes at least two layers of conductive traces separated by an intervening layer of insulating material. The conductive traces include straight segments and diagonal segments. A plurality of conductive vias, each including conductive via wing extensions, allow one to make electrical connections between the various conductive trace layers. The conductive vias are formed such that a narrow, non-conductive, gap exists between the via wing extensions and the conductive traces. The multi-chip module interconnection substrate is then programmed, e.g. in the field, by making electrical connections between the via wing extensions and the conductive traces using e.g. wire bonds or ball bonds formed by conventional wire bonding equipment.

REFERENCES:
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patent: 5160995 (1992-11-01), Wada et al.
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patent: 5541814 (1996-07-01), Janai et al.
patent: 5625207 (1997-04-01), Trolle et al.
Burman, S. and Sherwani, N., "Programmable Multichip Modules", IEEE Micro 13:28-35 (1993).
Stopper, H. et al., "Programmable MCMs for High Speed Applications", ICEMCM 191-196 (1995).

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