Gel for localized removal of reworkable encapsulant

Details Gel for localized removal of reworkable encapsulant Gel for localized removal of reworkable encapsulant

1997-07-14

1999-01-12

Lusignan, Michael

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

134 38, 134 40, C09D 900

Patent

active

058589430

ABSTRACT:
Reworkable encapsulant formulations are being developed to allow recovery of part-good microelectronic assemblies. According to this invention, a gelled form of the solvent is useful for removing the reworkable encapsulant from a specific region of the assemblies without affecting components on the assembly which do not need to be reworked. This novel method eliminates expensive tooling that would otherwise be required to handle the solvent.

REFERENCES:
patent: 4438692 (1984-03-01), Ancher et al.
patent: 4770714 (1988-09-01), Buchwald et al.
patent: 5185235 (1993-02-01), Sato et al.
patent: 5244507 (1993-09-01), Rowe

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