Gateless injection mold for encapsulating semiconductor devices

Details Gateless injection mold for encapsulating semiconductor devices Gateless injection mold for encapsulating semiconductor devices

1975-03-24

1977-01-18

Lazarus, Richard B.

Static molds

Uniting preform with molding material

Split mold clamps and supports preform

29588, 425121, 425129R, B29C 600

Patent

active

040035441

ABSTRACT:
In the step of plastic encapsulation of a semiconductive device, the inner ends of a group of leads comprising part of a lead frame, the semiconductive chip and the connections between the chip and the inner ends of the leads, are put into a cavity of a mold and fluid encapsulating material is forced into the cavity to surround the elements that are in the cavity with encapsulating material. A lead frame, which may be supplied in strip form, is provided, a part of which is so formed as to act as a gate for the admission of fluid encapsulating material into the mold cavity.

REFERENCES:
patent: 2108996 (1938-02-01), Sansome
patent: 3444441 (1969-05-01), Helda et al.
patent: 3606673 (1971-09-01), Overman
patent: 3650648 (1972-03-01), Lambrecht

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