Gated isolated structure

Boots – shoes – and leggings

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

364489, 364488, 437 75, 437 74, 357 48, 357 50, G06F 1560, H01L 2978

Patent

active

049377566

ABSTRACT:
The invention relates to a radiation-hardened (R-H) bulk CMOS process which is compatible with DRAM production and a specific gated isolation structure (GIS). The GIS structure consists of a novel oxide-silicon nitride-oxynitride gate insulator and a LPCVD polysilicon gate. A simple but automatically generating process for creating GIS directly from an original non-R-H device is also described. This generating process is fast and can revise any commercial products to a R-H version. The GIS is always shunted to Vss potential of the circuit chip to assure R-H capability. The grounded GIS structure replaces conventional LOCOS field oxide, which suffers from large threshold voltage shift when exposed to irradiation. Radiation resistance of this gated isolation structure (GIS) is suitable for application in radiation-immunity VLSI integrated circuits (.ltoreq.2um design rule).

REFERENCES:
patent: 3655457 (1972-04-01), Duffy et al.
patent: 3731375 (1973-05-01), Agusta et al.
patent: 4456918 (1984-06-01), Beasom
patent: 4495694 (1985-01-01), Beasom
patent: 4599576 (1986-07-01), Yoshida et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Gated isolated structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gated isolated structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gated isolated structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1130003

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.