Semiconductor device manufacturing: process – Making regenerative-type switching device – Having field effect structure
Reexamination Certificate
2002-12-30
2004-12-07
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Making regenerative-type switching device
Having field effect structure
C438S139000, C438S140000
Reexamination Certificate
active
06828177
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to a gate pad protection structure and a manufacturing method therefor, and more particular to a gate pad protection structure for a power semiconductor device and a manufacturing method therefor.
BACKGROUND OF THE INVENTION
Conventionally, the power semiconductor devices, e.g., MOSFET (Motel-Oxide-Semiconductor Field-Effect Transistor), IGBT (Isolated Gate Bipolar Transistor), or any other power semiconductor device having a gate pad structure, etc., generally has a gate pad protection structure for protecting and also avoiding the gate oxide layer being broken by the electric stress. Please refer to
FIG. 1
, it illustrates the schematic view of the gate pad protection structure of a power semiconductor device according to the prior art. As shown in
FIG. 1
, a thin gate oxide layer
11
is first formed on a silicon substrate
10
. Then, a polysilicon layer
12
is formed on the thin gate oxide layer
11
by a deposition. Sequentially, a photolithographic and an etching processes are executed on the polysilicon layer
12
of an active area to form a polysilicon window
1101
. Then, ion implantations are executed to form well area
101
, source area
102
and shallow junction area
103
on the silicon substrate
10
. Continuously, a dielectric layer
13
is formed on the polysilicon layer
12
, and then a portion of the dielectric layer
13
is removed by a photolithographic and an etching processes. Finally, a metal layer
14
as shown in
FIG. 1
is formed on the dielectric layer
13
to form a gate pad structure
15
. However, when the conventional power semiconductor device is applied a high voltage, the gate pad structure described above should be protected to avoid the gate oxide layer being broken by the high electric stress. The conventional protecting method is to form a deep junction
104
directly under the gate pad structure and thus forms a p-n junction on the silicon substrate
10
. This method will obviously reduce the field stresses of the surface of the silicon substrate and the area of the gate oxide layer. But this conventional method needs to increase a step of photo mask for forming the deep junction
104
in the process, especially for low voltage power semiconductor devices.
It is obviously known that how to provide an effective gate pad protection structure and to avoid the persecution of increasing one more step is a significant developing direction for the present invention. Thus, because of the technical defects described above, the applicant keeps on carving unflaggingly to develop a “gate pad protection structure for power semiconductor device and manufacturing method therefor” through wholehearted experience and research.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a gate pad protection structure for a power semiconductor device and a manufacturing method therefore for protecting and avoiding the gate oxide layer being broken by the electric stress.
It is another object of the present invention to provide a gate pad protection structure and a method therefor by forming a polysilicon window array on a polysilicon layer of an inactive area.
In accordance with an aspect of the present invention, a method for manufacturing a gate pad protection structure applied in a power semiconductor device, includes steps of (a) forming a gate oxide layer on a substrate, (b) forming a polysilicon layer on the gate oxide layer, (c) forming a polysilicon window and a polysilicon window array on the polysilicon layer, and (d) performing ion implantations via the polysilicon window and the polysilicon window array.
Preferably, the substrate is made of silicon.
Preferably, the power semiconductor device is one of MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) and IGBT (Isolated-Gate-Bipolar-Transistor) and any other power devices with gate-pad structures.
Preferably, the step (b) is executed by a chemical deposition.
Preferably, the step (c) is executed by a photolithographic and an etching processes.
Preferably, the step (d) further includes steps of (d1) forming a dielectric layer on the polysilicon layer and removing the dielectric layer over the polysilicon window, and (d2) forming a metal layer on the dielectric layer to form the gate pad protection structure.
Certainly, the step (d1) can be executed by a photolithographic and an etching processes.
Preferably, the step (d) is executed by a photo mask and ion implantations to form the field implantation area on the substrate corresponding to the polysilicon window and form the field implantation area cell array on the substrate corresponding to the polysilicon window array.
Certainly, the field implantation area cell array has plural field implantation area cells each of which is partially overlapped with a respective adjacent one to make an electrical short circuit and a ground connection.
Certainly, each of plural field implantation area cells substantially has an identical structure to that of the field implantation area.
In accordance with another aspect of the present invention, a gate pad protection structure for a power semiconductor device, includes a substrate, a field implantation area disposed in the substrate, a field implantation area cell array disposed in the substrate and having plural field implantation area cells each of which substantially has an identical structure to that of the field implantation area, wherein the field implantation area cell array and the field implantation area are simultaneously formed in the substrate, and a gate pad structure having a polysilicon window and a polysilicon window array formed on the substrate for protecting the gate pad structure by the field implantation area cell array.
Prefersbly, the substrate is made of silicon.
Prefersbly, the power semiconductor device is one of MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) and IGBT (Isolated-Gate-Bipolar-Transistor) and any other power devices with gate-pad structures.
Certainly, each of plural field implantation area cells can be overlapped with a respective adjacent one to make an electrical short circuit and a ground connection.
The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed descriptions and accompanying drawings, in which:
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patent: 6090653 (2000-07-01), Wu
patent: 6187619 (2001-02-01), Wu
patent: 6187643 (2001-02-01), Borland
patent: 2002/0149067 (2002-10-01), Mitros et al.
patent: 2004/0165459 (2004-08-01), Lee et al.
Wu Tzong-Shiann
Zeng Jun
Zhou Ming-Jiang
Coleman W. David
Kirton & McConkie
Krieger Michael F.
Nguyen Khiem
Pyramis Corporation
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