Gate break device and gate break method

Details Gate break device and gate break method Gate break device and gate break method

1995-12-06

1999-11-23

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

225 97, 225103, 225104, 29418, H01R 4300

Patent

active

059877375

ABSTRACT:
A device and method for positioning a resin-sealed lead frame that includes semiconductor devices and resin for sealing the semiconductor devices on the lead frame. A break unit is provided for moving the resin-sealed lead frame to a break table. The break unit includes a vacuum suction portion to hold the resin-sealed lead frame during movement and to release it when the resin-sealed lead frame is brought into a receiving opening associated with the break table. The receiving opening is defined by a plurality of guides with the outer tip portions of the guides providing the receiving opening as a space larger than that occupied by the outer configuration of the resin-sealed lead frame. The guides have a slope to position the resin-sealed lead frame onto the break table after it is released in the receiving opening. The break unit further includes push down pins for pushing down and breaking off unwanted extra portions of resin from beneath the resin-sealed lead frame. The break table is further provided with notches which have shapes corresponding to the shapes of unwanted extra portions of resin of the resin-sealed lead frame.

REFERENCES:
patent: 4560880 (1985-12-01), Petric et al.
patent: 4954307 (1990-09-01), Yokoyama
patent: 5044912 (1991-09-01), Billings et al.
patent: 5374021 (1994-12-01), Kleinman
patent: 5498942 (1996-03-01), Ijuin

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