Semiconductor device manufacturing: process – Having diamond semiconductor component
Reexamination Certificate
2008-12-05
2011-10-18
Landau, Matthew (Department: 2813)
Semiconductor device manufacturing: process
Having diamond semiconductor component
C438S172000, C438S570000, C257SE21041, C257SE21049, C257SE21096, C257SE21107, C257SE21603
Reexamination Certificate
active
08039301
ABSTRACT:
A gate after diamond transistor and method of making comprising the steps of depositing a first dielectric layer on a semiconductor substrate, depositing a diamond particle nucleation layer on the first dielectric layer, growing a diamond thin film layer on the first dielectric layer, defining an opening for the gate in the diamond thin film layer, patterning of the diamond thin film layer for a gate metal to first dielectric layer surface, etching the first dielectric layer, depositing and defining a gate metal, and forming a contact window opening in the diamond thin film layer and the first dielectric layer to the ohmic contact.
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patent: 2004/0192043 (2004-09-01), Makita et al.
patent: 2005/0202665 (2005-09-01), Namba et al.
patent: 2006/0043415 (2006-03-01), Okamoto et al.
patent: 2006/0174823 (2006-08-01), Sung
Hobart Karl
Kub Francis
Hunnius Stephen T.
Landau Matthew
Ressing Amy L.
Snow Colleen E
The United States of America as represented by the Secretary of
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