Gassing-free exposure mask

Details Gassing-free exposure mask Gassing-free exposure mask

2004-05-12

2008-03-18

Rosasco, S. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

Reexamination Certificate

active

07344807

ABSTRACT:
The present invention relates to an exposure mask for structuring a photoresist layer on a substrate wafer, in which an inorganic adhesive is used as an adhesive device for connecting a reticle having a lithographic structure, a frame and a pellicle. For chemical reasons, an adhesive of this type has no tendency or a considerably lower tendency to gassing out than an organic adhesive used in conventional exposure masks, so that the risk of particles which are deposited on the lithographic structure and which can cause projection errors during an exposure process is largely ruled out. The invention relates further to a method of producing such an inorganic adhesive and also a method of producing an exposure mask with the aid of such an inorganic adhesive.

REFERENCES:
patent: 6055040 (2000-04-01), Sego
patent: 6264773 (2001-07-01), Cerio
patent: 6548176 (2003-04-01), Gwo
patent: 2002/0098420 (2002-07-01), Eynon
patent: 102 33 424 (2003-02-01), None
Examination Report dated Jun. 10, 2005, directed to a counterpart foreign application.

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