Gas supply member and plasma processing apparatus

Details Gas supply member and plasma processing apparatus Gas supply member and plasma processing apparatus

2006-03-02

2008-08-26

Lund, Jeffrie R (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With gas inlet structure

C156S345330, C118S715000

Reexamination Certificate

active

07416635

ABSTRACT:
A gas supply member is disposed in a chamber of a plasma processing apparatus and has a planar surface facing an inner space of the chamber and a plurality of gas holes bored in the planar surface to supply a gas through the gas holes to the inner space. An outer periphery portion of each gas hole at the planar surface has a slant surface formed to correspond to a flow of the gas injected through each gas hole. Further, the slant surface includes at least any one of a flat surface and a curved surface. An angle formed between the slant surface and the planar surface is equal to or greater than that formed between the planar surface and a distribution of the gas injected through each gas hole.

REFERENCES:
patent: 4854263 (1989-08-01), Chang et al.
patent: 5589002 (1996-12-01), Su
patent: 2003/0140851 (2003-07-01), Janakiraman et al.
patent: 2006/0196604 (2006-09-01), Moriya et al.
patent: 2001-0083348 (2001-09-01), None

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