Gas shrouded wave soldering with gas knife

Details Gas shrouded wave soldering with gas knife Gas shrouded wave soldering with gas knife

1992-10-15

1993-08-31

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228219, 228 37, 228 42, B23K 100, B23K 308

Patent

active

052401693

ABSTRACT:
A cover plate or shroud extends over a solder reservoir and has a slot for a solder wave to extend up above the cover plate. A reduced oxygen atmosphere is supplied from gas outlets under the cover plate on both sides of the solder wave. Furthermore a gas knife is located to direct a stream of gas on an element such as a circuit board as it passes through the solder wave. The cover plate or shroud provides reduced oxides on the solder surfaces and the gas knife removes excess solder on elements that have been solder coated. The apparatus has a solder reservoir for holding solder with a solder nozzle projecting therefrom and a pump for forming a solder wave from the nozzle. Two solder waves may be provided each with their own cover plate and gas supplied on each side of each wave below the cover plate.

REFERENCES:
patent: 3216643 (1962-07-01), De Verter
patent: 3704686 (1972-12-01), Schrempp et al.
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 4412641 (1983-11-01), Fuchs et al.
patent: 4568012 (1986-02-01), Kakuhata et al.
patent: 5044542 (1991-09-01), Deambrosio
patent: 5048746 (1991-09-01), Elliott et al.

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