Gas shrouded wave soldering

Details Gas shrouded wave soldering Gas shrouded wave soldering

1992-03-30

1993-04-20

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

2281801, 228 37, 228 42, 228 561, B23K 100, B23K 308

Patent

active

052034895

ABSTRACT:
A cover plate extends over a solder reservoir and has a slot for a solder wave to extend up above the plate, a gas excluding oxygen is supplied under the cover plate and flows up through the slot on both sides of the solder wave to blanket the solder wave. It has been found that oxygen content on the surface of the solder and on the solder wave is reduced so that clean oxide free soldering occurs. The apparatus has a solder reservoir for holding solder with a solder nozzle projecting therefrom, a pump for forming a solder wave from the nozzle, a cover plate for covering at least a portion of the reservoir having a longitudinal slot for the solder wave to pass therethrough. Provision is made for supplying pressurized gas, which is oxygen free, to pass upwards through the slot on both sides of the solder wave to provide a gas blanket over the solder wave, and a conveyor conveys elements to be soldered to pass through the solder wave.

REFERENCES:
patent: 3216643 (1965-11-01), Verter
patent: 3704686 (1972-12-01), Schrempp et al.
patent: 4412641 (1983-11-01), Fuchs et al.
patent: 4568012 (1986-02-01), Kakuhata et al.

Affiliated with

Also associated with

Rating

Gas shrouded wave soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gas shrouded wave soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gas shrouded wave soldering will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1520028