Gas shrouded wave improvement

Details Gas shrouded wave improvement Gas shrouded wave improvement

1993-02-04

1994-03-08

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228219, 228 37, 228 42, B23K 100, B23K 308

Patent

active

052920550

ABSTRACT:
A cover plate extends over at least part of a solder reservoir and has a slot for a solder wave to extend up above the cover plate. Shield gas is supplied under the cover plate to blanket the solder wave and prevent air from contacting the solder wave and circuit boards passing through the solder wave. Circuit boards are generally supported by conveyor fingers at side edges and the fingers pass through the solder wave. End shrouds are provided at both ends of the solder wave to prevent the entry of air through the conveyor fingers and to ensure that the side edges of the circuit board are uniformly blanketed by shield gas directed to the side edges passing up through the slot in the cover plate. The under surface, front edge, back edge and side edges of a circuit board are therefore uniformly blanketed by shield gas as the board passes through a solder wave.

REFERENCES:
patent: 4412641 (1983-11-01), Fuchs et al.
patent: 5176307 (1993-01-01), Hagerty et al.
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5228614 (1993-07-01), Elliott et al.
patent: 5240169 (1993-08-01), Gileta

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