Gas shielding during plating

Details Gas shielding during plating Gas shielding during plating

1998-08-03

1999-04-20

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

205157, 205162, 205239, 205291, 428687, C25D 500, C25D 712, C25D 358, B23P 900

Patent

active

058955623

ABSTRACT:
Gas shielding is employed to prevent metal plating on contacts during electroplating to reduce particulate contamination and increase thickness uniformity. In another embodiment, gas shielding is employed to prevent deposition on the backside and edges of a semiconductor wafer during plating.

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