Gas shielding during plating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating moving substrate

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205157, 205162, 205239, 205291, 428687, C25D 500, C25D 712, C25D 358, B23P 900

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active

058955623

ABSTRACT:
Gas shielding is employed to prevent metal plating on contacts during electroplating to reduce particulate contamination and increase thickness uniformity. In another embodiment, gas shielding is employed to prevent deposition on the backside and edges of a semiconductor wafer during plating.

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