Etching a substrate: processes – Gas phase etching of substrate
Patent
1998-02-26
2000-10-24
Gupta, Yogendra
Etching a substrate: processes
Gas phase etching of substrate
216 67, 20429833, 156345, 438706, 438710, C23F 102, C23F 124, C03C 2568
Patent
active
061362131
ABSTRACT:
Etching of an object is achieved by jetting etching gas onto the object from a gas jetting nozzle. A gas jetting pipe for jetting the etching gas and a discharge pipe for discharging the jetted gas are designed as a coaxial dual pipe structure. The etching gas is jetted from the gas jetting pipe toward the object and, at the same time, excess etching gas is discharged through the discharge pipe.
Fukunaga Akira
Miyoshi Kaori
Shinozuka Syuhei
Boyer Charles
Ebara Corporation
Gupta Yogendra
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