Gas introducing mechanism and processing apparatus for...

Details Gas introducing mechanism and processing apparatus for... Gas introducing mechanism and processing apparatus for...

2011-02-15

2011-02-15

Cleveland, Michael (Department: 1712)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With gas inlet structure

C118S715000

Reexamination Certificate

active

07887670

ABSTRACT:
The present invention provides a gas introducing mechanism and a processing apparatus for processing an object to be processed, which can supply a gas uniformly over the whole region of a processing space so as to enhance uniformity of a process in the surface of the object to be processed. The gas introducing mechanism50, which is adapted to provide a process to the object W to be processed, by using the gas, in a processing vessel4, includes a gas introducing ring member54for introducing the gas from the exterior of the processing vessel4, a disk-like rotary base56provided rotatably below a top plate48in the processing vessel4, and a ring-shaped gas injection ring member60provided around a rotary base56so as to be closer and opposed to the gas introducing ring member54. A gas injecting slit58is provided in the ring-shaped gas injection ring member60, the slit58being formed along the circumferential direction of the rotary base. A ring-shaped gas guide groove62is provided on at least either one of opposing side faces of the gas introducing ring member54and gas injection ring member60, along the circumferential direction, corresponding to a gas introducing port.

REFERENCES:
patent: 5851589 (1998-12-01), Nakayama et al.
patent: RE36957 (2000-11-01), Brors et al.
patent: 6590186 (2003-07-01), Tanaka et al.
patent: 2004/0082251 (2004-04-01), Bach et al.
patent: 2006/0228473 (2006-10-01), Satoh et al.
patent: 10-79380 (1998-03-01), None
patent: 2002-217183 (2002-08-01), None
patent: 2004-79985 (2004-03-01), None

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