Gas flow distribution system for molten solder dispensing proces

Details Gas flow distribution system for molten solder dispensing proces Gas flow distribution system for molten solder dispensing proces

1993-08-02

1994-06-14

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 42, 228 52, 222603, B23K 306

Patent

active

053202732

ABSTRACT:
A gas flow distribution system for a solder dispensing head includes a base member adapted to be connected to the solder dispensing head and a structure connected to a source of an inert gas for distributing at least one continuous stream of the inert gas radially and axially below the solder dispensing head to exclude oxygen in the surrounding air therefrom.

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patent: 4564135 (1986-01-01), Barresi et al.
patent: 4606493 (1986-08-01), Christoph et al.
patent: 4805827 (1989-02-01), Coffman et al.
patent: 4844325 (1989-07-01), Nishiguchi et al.
patent: 5065932 (1991-11-01), Hayden et al.
patent: 5193738 (1993-03-01), Hayes
patent: 5222649 (1993-06-01), Funari et al.

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