Gas flow controlling device and soldering apparatus using same

Details Gas flow controlling device and soldering apparatus using same Gas flow controlling device and soldering apparatus using same

1998-01-14

2000-09-12

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Gaseous flux

228 37, 228219, 22 3, 22 4, B23K 100, B23K 108, B23K 3102, B67D 500

Patent

active

061164917

ABSTRACT:
A gas flow controlling device including a housing having a gas inlet and a gas outlet and defining therewithin a gas flow passage diverging in the direction from the inlet to the outlet so that the cross-sectional area of the gas flow passage increases from the inlet to the outlet, and a plurality of spaced apart baffle plates provided in the gas flow passage to render the gas flow passage meandering. An apparatus for soldering an article, including a wave-soldering zone for contacting the article with a solder wave, and one or more above-mentioned gas flow controlling devices for establishing an inert gas atmosphere in the soldering zone.

REFERENCES:
patent: 4143470 (1979-03-01), Vandergriff
patent: 4564135 (1986-01-01), Barresi et al.
patent: 5121874 (1992-06-01), Deambrosio et al.
patent: 5358167 (1994-10-01), Tachibana et al.
patent: 5409159 (1995-04-01), Connors et al.
patent: 5685475 (1997-11-01), Jairazbhoy
patent: 5794836 (1998-08-01), Lin et al.

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