Gas encapsulated cooling module

Details Gas encapsulated cooling module Gas encapsulated cooling module

1977-09-12

1979-02-06

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 75, 357 76, 357 79, 165 80, H01L 2504, H01L 2342, H01L 2344

Patent

active

041386922

ABSTRACT:
A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.

REFERENCES:
patent: 2780757 (1957-02-01), Thornhill et al.
patent: 3307087 (1967-02-01), Rogers et al.
patent: 3649738 (1972-03-01), Andersson et al.
patent: 3703668 (1972-11-01), Bylund et al.
patent: 3826957 (1974-07-01), McLaughlin
patent: 3991396 (1976-11-01), Barkan
patent: 3993123 (1976-11-01), Chu et al.
patent: 4067042 (1978-01-01), Novak et al.

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