Gas distribution system for sputtering cathodes

Details Gas distribution system for sputtering cathodes Gas distribution system for sputtering cathodes

1982-03-30

1984-01-10

Kaplan, G. L.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, C23C 1500

Patent

active

044252188

ABSTRACT:
A gas distribution system for use with a sputtering cathode mounted in a vacuum chamber and provided with a planar target formed of the material to be sputtered upon planar substrates passing therebeneath, in which two divergent streams of gas are introduced into the vacuum chamber, one of the gases being an inert gas directed into the upper portion of the chamber adjacent the target and the other gas being a reactive gas directed into the lower portion of the chamber adjacent the substrate.

REFERENCES:
patent: 3976555 (1976-08-01), Von Hartel

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